QUES: The army is also changing its base unit from divisions to brigades. Division lineage will be retained, but the divisional headquarters will be able to command any brigade, not just brigades that carry their divisional lineage. The central part of this plan is that each brigade will be modular, i.e., all brigades of the same type will be exactly the same, and thus any brigade can be commanded by any division. As specified before the 2013 end-strength re-definitions, the three major types of ground combat brigades are:

How will the brigades be structured?
What is the answer?
ANS: modular
QUES: Emulation of the SNES is now available on handheld units, such as Android devices, Apple's iPhone and iPad, Sony's PlayStation Portable (PSP), the Nintendo DS and Game Boy Advance, the Gizmondo, the Dingoo and the GP2X by GamePark Holdings, as well as PDAs. While individual games have been included with emulators on some GameCube discs, Nintendo's Virtual Console service for the Wii marks the introduction of officially sanctioned general SNES emulation, though SNES9x GX, a port of SNES9x, has been made for the Wii.

What portable game systems have SNES emulators?
What is the answer?
ANS: Sony's PlayStation Portable (PSP), the Nintendo DS and Game Boy Advance, the Gizmondo, the Dingoo and the GP2X by GamePark Holdings
QUES: There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known pre-preg materials used in the PCB industry are FR-2 (phenolic cotton paper), FR-3 (cotton paper and epoxy), FR-4 (woven glass and epoxy), FR-5 (woven glass and epoxy), FR-6 (matte glass and polyester), G-10 (woven glass and epoxy), CEM-1 (cotton paper and epoxy), CEM-2 (cotton paper and epoxy), CEM-3 (non-woven glass and epoxy), CEM-4 (woven glass and epoxy), CEM-5 (woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability.

To what type of packaging is thermal expansion particularly critical?
What is the answer?
ANS:
ball grid array