Context and question: Chemical defense is another important defense found amongst species of Coleoptera and Lepidoptera, usually being advertised by bright colors, such as the Monarch butterfly. They obtain their toxicity by sequestering the chemicals from the plants they eat into their own tissues. Some Lepidoptera manufacture their own toxins. Predators that eat poisonous butterflies and moths may become sick and vomit violently, learning not to eat those types of species; this is actually the basis of Müllerian mimicry. A predator who has previously eaten a poisonous lepidopteran may avoid other species with similar markings in the future, thus saving many other species as well. Some ground beetles of the Carabidae family can spray chemicals from their abdomen with great accuracy, to repel predators.
Insects become toxic by doing what with the chemicals from plants?
Answer: sequestering
Context and question: The Unicode Roadmap Committee (Michael Everson, Rick McGowan, and Ken Whistler) maintain the list of scripts that are candidates or potential candidates for encoding and their tentative code block assignments on the Unicode Roadmap page of the Unicode Consortium Web site. For some scripts on the Roadmap, such as Jurchen, Nü Shu, and Tangut, encoding proposals have been made and they are working their way through the approval process. For others scripts, such as Mayan and Rongorongo, no proposal has yet been made, and they await agreement on character repertoire and other details from the user communities involved.
What does the Unicode Roadmap Commmittee do? 
Answer: maintain the list of scripts that are candidates or potential candidates for encoding
Context and question: Through-hole manufacture adds to board cost by requiring many holes to be drilled accurately, and limits the available routing area for signal traces on layers immediately below the top layer on multi-layer boards since the holes must pass through all layers to the opposite side. Once surface-mounting came into use, small-sized SMD components were used where possible, with through-hole mounting only of components unsuitably large for surface-mounting due to power requirements or mechanical limitations, or subject to mechanical stress which might damage the PCB.
A component might not be able to be made any smaller because of its mechanical limitations or what other need?
Answer:
power requirements