Article: Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much smaller PCB assemblies with much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labor costs and greatly increasing production rates. Components can be supplied mounted on carrier tapes. Surface mount components can be about one-quarter to one-tenth of the size and weight of through-hole components, and passive components much cheaper; prices of semiconductor surface mount devices (SMDs) are determined more by the chip itself than the package, with little price advantage over larger packages. Some wire-ended components, such as 1N4148 small-signal switch diodes, are actually significantly cheaper than SMD equivalents.

Question: Is it the chip or the package that influences the price of an SMD more?
Ans: chip


Article: By the January 2004 Iowa caucuses, the field had dwindled down to nine candidates, as Bob Graham had dropped out of the race. Howard Dean was a strong front-runner. However, the Iowa caucuses yielded unexpectedly strong results for Democratic candidates John Kerry, who earned 38% of the state's delegates and John Edwards, who took 32%. Former front-runner Howard Dean slipped to 18% and third place, and Richard Gephardt finished fourth (11%). In the days leading up to the Iowa vote, there was much negative campaigning between the Dean and Gephardt camps.

Question: Preceding the Iowa caucuses, which candidates used naysaying tactics in their campaigning?
Ans: Dean and Gephardt


Article: During the time between 800 and 200 BCE the Shramana-movement formed, from which originated Jainism and Buddhism. In the same period the first Upanishads were written. After 500 BCE, the so-called "Second urbanization" started, with new urban settlements arising at the Ganges plain, especially the Central Ganges plain. The Central Ganges Plain, where Magadha gained prominence, forming the base of the Mauryan Empire, was a distinct cultural area, with new states arising after 500 BC[web 1] during the so-called "Second urbanization".[note 3] It was influenced by the Vedic culture, but differed markedly from the Kuru-Panchala region. It "was the area of the earliest known cultivation of rice in South Asia and by 1800 BC was the location of an advanced neolithic population associated with the sites of Chirand and Chechar". In this region the Shramanic movements flourished, and Jainism and Buddhism originated.

Question: What philosophical movement appeared during 800-200 BCE?
Ans: Shramana-movement


Article: The first practical ICs were invented by Jack Kilby at Texas Instruments and Robert Noyce at Fairchild Semiconductor. Kilby recorded his initial ideas concerning the integrated circuit in July 1958, successfully demonstrating the first working integrated example on 12 September 1958. In his patent application of 6 February 1959, Kilby described his new device as "a body of semiconductor material ... wherein all the components of the electronic circuit are completely integrated". Noyce also came up with his own idea of an integrated circuit half a year later than Kilby. His chip solved many practical problems that Kilby's had not. Produced at Fairchild Semiconductor, it was made of silicon, whereas Kilby's chip was made of germanium.

Question: Noyce's IC was made up of what material?
Ans:
silicon